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XC95108 In-System Programmable
CPLD
â
December 4, 1998 (Version 3.0)
Product Specification
1
1*
Features
• 7.5 ns pin-to-pin logic delays on all pins
•
CNT
to 125 MHz
• 108 macrocells with 2400 usable gates
• Up to 108 user I/O pins
• 5 V in-system programmable (ISP)
- Endurance of 10,000 program/erase cycles
- Program/erase over full commercial voltage and
temperature range
• Enhanced pin-locking architecture
• Flexible 36V18 Function Block
- 90 product terms drive any or all of 18 macrocells
within Function Block
- Global and product term clocks, output enables, set
and reset signals
• Extensive IEEE Std 1149.1 boundary-scan (JTAG)
support
• Programmable power reduction mode in each
macrocell
• Slew rate control on individual outputs
• User programmable ground pin capability
• Extended pattern security features for design protection
• High-drive 24 mA outputs
• 3.3 V or 5 V I/O capability
• Advanced CMOS 5V FastFLASH technology
• Supports parallel programming of more than one
XC9500 concurrently
• Available in 84-pin PLCC, 100-pin PQFP, 100-pin TQFP
and 160-pin PQFP packages
Power Management
Power dissipation can be reduced in the XC95108 by con-
figuring macrocells to standard or low-power modes of
operation. Unused macrocells are turned off to minimize
power dissipation.
Operating current for each design can be approximated for
specific operating conditions using the following equation:
I
CC
(mA) =
MC
HP
(1.7) + MC
LP
(0.9) + MC (0.006 mA/MHz) f
Where:
MC
HP
= Macrocells in high-performance mode
MC
LP
= Macrocells in low-power mode
MC = Total number of macrocells used
f = Clock frequency (MHz)
Figure1
shows a typical calculation for the XC95108
device.
300
(250)
200
(180)
(170)
Description
The XC95108 is a high-performance CPLD providing
advanced in-system programming and test capabilities for
general purpose logic integration. It is comprised of six
36V18 Function Blocks, providing 2,400 usable gates with
propagation delays of 7.5 ns. See
Figure2
for the architec-
ture overview.
100
0
50
100
Clock Frequency (MHz)
X5898
Figure 1: Typical I
CC
vs. Frequency for XC95108
December 4, 1998 (Version 3.0)
1
 XC95108 In-System Programmable CPLD
3
JTAG
Controller
In-System Programming Controller
1
JTAG Port
36
Function
Block 1
Macrocells
1 to 18
18
I/O
I/O
I/O
36
I/O
Function
Block 2
18
Macrocells
1 to 18
I/O
Blocks
I/O
36
Function
Block 3
I/O
18
Macrocells
1 to 18
I/O
I/O
3
I/O/GCK
36
Function
Block 4
1
18
I/O/GSR
Macrocells
1 to 18
2
I/O/GTS
36
Function
Block 5
18
Macrocells
1 to 18
36
Function
Block 6
18
Macrocells
1 to 18
X5897
Figure 2: XC95108 Architecture
Note:
Function Block outputs (indicated by the bold line) drive the I/O Blocks directly
2
December 4, 1998 (Version 3.0)
 XC95108 In-System Programmable CPLD
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
V
CC
Supply voltage relative to GND
-0.5 to 7.0
V
V
IN
DC input voltage relative to GND
-0.5 to V
CC
+ 0.5
V
V
TS
Voltage applied to 3-state output with respect to GND
-0.5 to V
CC
+ 0.5
V
T
STG
Storage temperature
-65 to +150
°
C
T
SOL
Max soldering temperature (10 s @ 1/16 in = 1.5 mm)
+260
°
C
Warning:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Rating conditions for extended periods
of time may affect device reliability.
Recommended Operation Conditions
1
Symbol
Parameter
Min
Max
Units
V
CCINT
Supply voltage for internal logic and input buffer
4.75
(4.5)
5.25
(5.5)
V
V
CCIO
Supply voltage for output drivers for 5 V operation
4.75 (4.5)
5.25 (5.5)
V
Supply voltage for output drivers for 3.3 V operation
3.0
3.6
V
V
IL
Low-level input voltage
0
0.80
V
V
IH
High-level input voltage
2.0
V
CCINT
+0.5
V
V
O
Output voltage
0
V
CCIO
V
Note:
1. Numbers in parenthesis are for industrial-temperature range versions.
Endurance Characteristics
Symbol
Parameter
Min
Max
Units
Data Retention
20
-
Years
t
DR
N
PE
Program/Erase Cycles
10,000
-
Cycles
December 4, 1998 (Version 3.0)
3
 XC95108 In-System Programmable CPLD
DC Characteristics Over Recommended Operating Conditions
Symbol
Parameter
Test Conditions
Min
Max
Units
V
OH
Output high voltage for 5 V operation
I
OH
= -4.0 mA
V
CC
= Min
2.4
V
Output high voltage for 3.3 V operation
I
OH
= -3.2 mA
V
CC
= Min
V
2.4
V
OL
Output low voltage for 5 V operation
I
OL
= 24 mA
V
CC
= Min
0.5
V
Output low voltage for 3.3 V operation
I
OL
= 10 mA
V
CC
= Min
0.4
V
I
IL
Input leakage current
V
CC
= Max
V
IN
= GND or V
CC
±
10.0
m
A
I
IH
I/O high-Z leakage current
V
CC
= Max
V
IN
= GND or V
CC
±
10.0
m
A
C
IN
I/O capacitance
V
IN
= GND
f = 1.0 MHz
10.0
pF
I
CC
Operating Supply Current
(low power mode, active)
V
I
= GND, No load
f = 1.0 MHz
100 (Typ)
ma
AC Characteristics
XC95108-7 XC95108-10XC95108-15 XC95108-20
Symbol
Parameter
Units
Min
Max
Min
Max
Min
Max
Min
Max
t
PD
I/O to output valid
7.5
10.0
15.0
20.0
ns
t
SU
I/O setup time before GCK
4.5
6.0
8.0
10.0
ns
t
H
I/O hold time after GCK
0.0
0.0
0.0
0.0
ns
t
CO
GCK to output valid
4.5
6.0
8.0
10.0
ns
f
CNT
1
16-bit counter frequency
125.0
111.1
95.2
83.3
MHz
f
SYSTEM
2
Multiple FB internal operating frequency
83.3
66.7
55.6
50.0
MHz
t
PSU
I/O setup time before p-term clock input
0.5
2.0
4.0
4.0
ns
t
PH
I/O hold time after p-term clock input
4.0
4.0
4.0
6.0
ns
t
PCO
P-term clock to output valid
8.5
10.0
12.0
16.0
ns
t
OE
GTS to output valid
5.5
6.0
11.0
16.0
ns
t
OD
GTS to output disable
5.5
6.0
11.0
16.0
ns
t
POE
Product term OE to output enabled
9.5
10.0
14.0
18.0
ns
t
POD
Product term OE to output disabled
9.5
10.0
14.0
18.0
ns
t
WLH
GCK pulse width (High or Low)
4.0
4.5
5.5
5.5
ns
Note:
1. f
CNT
is the fastest 16-bit counter frequency available, using the local feedback when applicable.
f
CNT
is also the Export Control Maximum flip-flop toggle rate, f
TOG
.
2. f
SYSTEM
is the internal operating frequency for general purpose system designs spanning multiple FBs.
4
December 4, 1998 (Version 3.0)
 XC95108 In-System Programmable CPLD
V
T
E
ST
R
1
Output Type
V
CCIO
5.0 V
3.3 V
V
TEST
5.0 V
3.3 V
R
1
160
R
2
120
C
L
35 pF
35 pF
Device Output
W
W
260
W
360
W
R
2
C
L
X5906
Figure 3: AC Load Circuit
Internal Timing Parameters
XC95108-7 XC95108-10XC95108-15 XC95108-20
Symbol
Parameter
Units
Min
Max
Min
Max
Min
Max
Min
Max
Buffer Delays
t
IN
Input buffer delay
2.5
3.5
4.5
6.5
ns
t
GCK
GCK buffer delay
1.5
2.5
3.0
3.0
ns
t
GSR
GSR buffer delay
4.5
6.0
7.5
9.5
ns
t
GTS
GTS buffer delay
5.5
6.0
11.0
16.0
ns
t
OUT
Output buffer delay
2.5
3.0
4.5
6.5
ns
t
EN
Output buffer enable/disable delay
0.0
0.0
0.0
0.0
ns
Product Term Control Delays
t
PTCK
Product term clock delay
3.0
3.0
2.5
2.5
ns
t
PTSR
Product term set/reset delay
2.0
2.5
3.0
3.0
ns
t
PTTS
Product term 3-state delay
4.5
3.5
5.0
5.0
ns
Internal Register and Combinatorial delays
t
PDI
Combinatorial logic propagation delay
0.5
1.0
3.0
4.0
ns
t
SUI
Register setup time
1.5
2.5
3.5
3.5
ns
t
HI
Register hold time
3.0
3.5
4.5
6.5
ns
t
COI
Register clock to output valid time
0.5
0.5
0.5
0.5
ns
t
AOI
Register async. S/R to output delay
6.5
7.0
8.0
8.0
ns
t
RAI
Register async. S/R recovery before clock 7.5
10.0
10.0
10.0
ns
t
LOGI
Internal logic delay
2.0
2.5
3.0
3.0
ns
t
LOGILP
Internal low power logic delay
10.0
11.0
11.5
11.5
ns
Feedback Delays
t
F
FastCONNECT matrix feedback delay
8.0
9.5
11.0
13.0
ns
t
LF
Function Block local feeback delay
4.0
3.5
3.5
5.0
ns
Time Adders
t
PTA
3
Incremental Product Term Allocator delay
1.0
1.0
1.0
1.5
ns
t
SLEW
Slew-rate limited delay
4.0
4.5
5.0
5.5
ns
Note:
3. t
PTA
is multiplied by the span of the function as defined in the family data sheet.
December 4, 1998 (Version 3.0)
5
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